TEC1-12703 12704 12705 12706 12707 12708 12709 12710 12712 12715 Semiconductor Cooling Chip RefrigeratorItem NO.: TEC1

TEC1 Semiconductor Refrigeration Chip

Product Information:

1、 A dry battery can be used to test the quality of the cooling strip. The operation method is as follows: hold the two sides of the cooling sheet with one hand, and press the lead of the cooling sheet on the two poles of the battery with the other hand (the red line is pressed on the positive pole and the black line is pressed on the negative pole). If one side is slightly cold and the other side is slightly hot, it means that the cooling sheet is good and can work normally.

2、 The working state of the cooling fin is that it cools and heats at the same time. When the cooling fin is working, the hot surface must be well cooled. It is strictly forbidden to power on the cooling fin for more than 2 seconds without heat dissipation, which will cause overheating and burning to the buyer at his own expense. The electrification of the cold and hot exchange of the cooling sheet must be carried out when the cold and hot sides recover to the room temperature (generally more than 5 minutes), otherwise the circuit of the cooling sheet may be damaged and the ceramic panel may be broken.

3、 When the cooling sheet is used for cooling, the red line is connected to the positive pole of the power supply, and the black line is connected to the negative pole of the power supply. The power supply requires the use of a switching power supply with a ripple factor of less than 10%. Generally, the ceramic panel with wire welded is a hot surface. If the red wire is connected to the negative pole of the power supply, and the black wire is connected to the positive pole of the power supply, the cold and hot sides of the cooling sheet will be adjusted.

4、 Do not connect the power supply when the radiator is not installed on the hot surface of the cooling fin; Poor heat dissipation of the hot surface will cause the temperature to be too high to exceed the limit temperature of the hot surface of the cooling fin by 100 degrees, which will cause the cooling fin to overheat and burn out. Because the cooling sheet is cooled by the temperature difference between the hot and cold surfaces, the lower the temperature of the hot surface, the lower the temperature of the cold surface, and the better the cooling effect.

5、 The cooling sheet is composed of two ceramic panels and semiconductor materials through low melting point solder. The strength is not high, and it belongs to fragile materials. Users must handle it with care, do not bump it, and do not fall from a height, to avoid damage caused by the fracture of the ceramic panel.

Be Careful:

The radiator must be coated with thermal conductive silicone grease. Some words are cold noodles, while no words are hot noodles.

Product Parameter 12703:

● Chip model: TEC1-12703

● Boundary dimension: 40 * 40 * 4.0mm ± 0.1 element pairs 127

● Wire specification: lead length 310mm ± 5mm RV standard wire single end 5mm tinned

● Internal resistance: 4.0~4.3 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 60 ℃.

● Working current: Imax=12 (when starting at rated voltage)

● Rated voltage: DC12V (Vmax: 15.5V)

● Cooling power: Qcmax 27W

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (excessive ambient temperature drop directly affects the refrigeration efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12704:

● Chip model: TEC1-12704

● Boundary dimension: 40 * 40 * 4.2mm element pairs 127

● Wire specification: lead length 100 ± 5mm, RV standard lead single end 5mm tinned

● Internal resistance: 3.0~3.3 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 60 ℃.

● Working current: Imax=12 (when starting at rated voltage)

● Rated voltage: DC12V (Vmax: 15.5V)

● Cooling power: Qcmax 36W

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (high ambient temperature will directly affect the refrigeration efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12705:

● Chip model: TEC1-12705

● Boundary dimension: 40 * 40 * 3.8mm element pairs 127

● Wire specification: lead length 100 ± 5mm, RV standard lead single end 5mm tinned

● Internal resistance: 2.4~2.7 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 61 ℃.

● Working current: Imax=5 (when starting at rated voltage)

● Rated voltage: DC12V (Vmax: 15.5V)

● Cooling power: Qcmax 45W

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (high ambient temperature will directly affect the refrigeration efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12706:

● Chip model: TEC1-12706

● External dimension: 40 * 40 * 3.75mm

● Internal resistance: 2.1~2.4 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 59 ℃.

● Working current: Imax=4.3-4.6A (at rated 12V)

● Rated voltage: 12V (Vmax: 15V starting current 5.8A)

● Cooling power: Qcmax 60-72W

● Working environment: temperature range - 55 ℃~83 ℃ (excessive ambient temperature drop directly affects the refrigeration efficiency)

Product Parameter 12707:

● Chip model: TEC1-12707

● Boundary dimension: 40 * 40 * 3.5mm element pairs 127

● Wire specification: lead length 300 ± 8mm, RV standard lead single end 5mm tinned

●Imax：7A

●Vmax：13.0V

● Δ Tmax：≥68℃

●Qcmax：65W

●TR：-50~100℃

● Assembly pressure: 98N/cm2

● Packaging process: standard 704 silicone rubber sealing around

● Storage conditions: storage environment with ambient temperature of - 10 ℃~40 ℃, relative humidity of not more than 80%, ventilation and no corrosive gas

Product Parameter 12708:

● Chip model: TEC1-12708

● Boundary dimension: 40 * 40 * 3.5mm element pairs 127

● Wire specification: lead length 300 ± 8mm, RV standard lead single end 5mm tinned

● Internal resistance: 1.5~1.7 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 60 ℃.

● Working current: Imax=8A (when starting at rated voltage)

● Rated voltage: DC12V (Vmax: 15.5V)

● Cooling power: Qcmax 77W

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (high ambient temperature will directly affect the refrigeration efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12709:

● Chip model: TEC1-12709

● Boundary dimension: 40 * 40 * 3.4mm element pairs 127

● Wire specification: lead length 300 ± 5mm RV standard wire single end 5mm tinned

● Large temperature difference: △ Tmax (Qc=0) above 68 ℃.

● Working current: Imax=9A (when 15Vmax voltage starts)

● Rated voltage: DC12V (Vmax: 15.2V)

● Cooling power: Qcmax 82W

● Working environment: temperature range - 55 ℃~83 ℃ (excessive ambient temperature will directly affect cooling efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12710:

● Chip model: TEC1-12710

● Boundary dimension: 40 * 40 * 3.4mm element pairs 127

● Wire specification: lead length 300 ± 5mm RV standard wire single end 5mm tinned

● Internal resistance: 1.2~1.5 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 60 ℃.

● Working current: Imax=10A (when 15Vmax voltage starts)

● Rated voltage: DC12V (Vmax: 15.5V)

● Cooling power: Qcmax 92W

● Assembly pressure: 85N/cm

● Working environment: temperature range - 55 ℃~83 ℃ (excessive ambient temperature will directly affect cooling efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12712:

● Chip model: TEC1-12712

● Boundary dimension: 40 * 40 * 3.3mm element pairs 127 pairs

● Wire specification: lead length 200 ± 8mm, RV standard wire single end 5mm tinned

● Internal resistance: 1.0~1.1 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: above 68 ℃

● Working current: Imax=12A (12A when starting at high voltage of 15.5V)

● Rated voltage: DC12V (large voltage: 15.5V)

● Cooling power: 107W (too high temperature of cooling surface will reduce cooling power)

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (high ambient temperature will directly affect the refrigeration efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃

Product Parameter 12715:

● Chip model: TEC1-12715

● Boundary dimension: 40 * 40 * 3.3mm element pairs 127

● Wire specification: lead length 300 ± 5mm RV standard wire single end 5mm tinned

● Internal resistance: 1.2~1.5 Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test)

● Large temperature difference: △ Tmax (Qc=0) above 65 ℃.

● Working current: Imax=15A (when 15Vmax voltage starts)

● Rated voltage: DC12V (Vmax: 15.4V)

● Cooling power: Qcmax 134W

● Assembly pressure: 85N/cm2

● Working environment: temperature range - 55 ℃~83 ℃ (excessive ambient temperature will directly affect cooling efficiency)

● Packaging process: standard 704 silicone rubber sealing around

● Packaging standard: foam box packaging, storage conditions, ambient temperature - 10 ℃~40 ℃

● Storage conditions: - 40~60 ℃